The Dragonfly G2 platform is a new, modular system that delivers up to 150% improvement in productivity over legacy systems and exceeds competitive system throughputs. It combines 2D with 3D Truebump™ Technology for accurate copper pillar/bump height measurements, and uses Clearfind™ Technology to detect non-visual residue defects. Advanced sensor technology measures 3D features and CD metrology. The platform is specifically designed to measure, collect, and analyze data from bump interconnects nearing 100 million bumps per wafer using Rudolph’s Discover® software and advanced computing architecture. This provides a flexible, plug-and-play solution for improved productivity and accuracy in the measurement of bump interconnects.